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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Device Type Classification | Top Mount, Skived | |
| Thermal Package Design | BGA | |
| Mounting Technique | Push Pin | |
| Physical Shape Form | Square, Fins | |
| Linear Length Dimension | 3.150" (80.00mm) | |
| Horizontal Width Dimension | 3.150" (80.00mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.472" (12.00mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 1.20°C/W @ 200 LFM | |
| Passive Cooling Resistance | 5.10°C/W | |
| Construction Material Type | Copper | |
| Surface Material Treatment | AavSHIELD 3C |
Description
Fastened using a Push Pin method for dependable placement. Records the fin height at 0.472" (12.00mm). Overall length 3.150" (80.00mm) for size indication. Type of construction material Copper for durability and efficiency. Coating AavSHIELD 3C for safeguarding and aesthetic enhancement. Type of housing Tray for safeguarding or transporting components. Layout of the thermal management package BGA aimed at cooling. Product status Active concerning availability and lifecycle. Shape Square, Fins for the part or device. Thermal resistance with fan assistance 1.20°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 5.10°C/W for heat regulation. Type classification Top Mount, Skived for specifications. Horizontal width measurement 3.150" (80.00mm).
