Attribute
Description
Manufacturer Part Number
374724B60024G
Manufacturer
Description
HEATSINK BGA W/O SOLDER ANCHORS
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 122

Quantity Unit Price Ext. Price
60 ₹ 147.74000 ₹ 8,864.40

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
55 ₹ 147.74000 ₹ 8,125.70

Stock:

Distributor: 11


Quantity Unit Price Ext. Price
168 ₹ 302.60000 ₹ 50,836.80

Stock:

Distributor: 113


Quantity Unit Price Ext. Price
5 ₹ 710.22000 ₹ 3,551.10
50 ₹ 613.03000 ₹ 30,651.50
168 ₹ 566.93000 ₹ 95,244.24
336 ₹ 564.44000 ₹ 1,89,651.84
504 ₹ 561.95000 ₹ 2,83,222.80
1008 ₹ 558.21000 ₹ 5,62,675.68
2520 ₹ 555.72000 ₹ 14,00,414.40
5040 ₹ 553.22000 ₹ 27,88,228.80

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design BGA
Mounting Technique Solder Anchor
Physical Shape Form Square, Pin Fins
Linear Length Dimension 1.378" (35.00mm)
Horizontal Width Dimension 1.378" (35.00mm)
Circular Measurement -
Heat Sink Fin Elevation 0.709" (18.00mm)
Power at Temp Increase 3.0W @ 50°C
Thermal Resistance with Fan 5.20°C/W @ 200 LFM
Passive Cooling Resistance 15.30°C/W
Construction Material Type Aluminum
Surface Material Treatment Black Anodized