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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Assorted (BGA, LGA, CPU, ASIC...) | |
| Mounting Technique | PC Pin | |
| Physical Shape Form | Square, Pin Fins | |
| Linear Length Dimension | 0.551" (14.00mm) | |
| Horizontal Width Dimension | 0.551" (14.00mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.500" (12.70mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | 16.00°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a PC Pin method for dependable placement. Records the fin height at 0.500" (12.70mm). Overall length 0.551" (14.00mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package Assorted (BGA, LGA, CPU, ASIC...) aimed at cooling. Product status Active concerning availability and lifecycle. Shape Square, Pin Fins for the part or device. Thermal resistance in natural airflow 16.00°C/W for heat regulation. Type classification Top Mount for specifications. Horizontal width measurement 0.551" (14.00mm).
