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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Board Level, Vertical | |
| Thermal Package Design | TO-220 | |
| Mounting Technique | Bolt On and PC Pin | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 0.750" (19.05mm) | |
| Horizontal Width Dimension | 0.520" (13.21mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.250" (6.35mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | 28.00°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a Bolt On and PC Pin method for dependable placement. Records the fin height at 0.250" (6.35mm). Overall length 0.750" (19.05mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package TO-220 aimed at cooling. Product status Active concerning availability and lifecycle. Shape Rectangular, Fins for the part or device. Thermal resistance in natural airflow 28.00°C/W for heat regulation. Type classification Board Level, Vertical for specifications. Horizontal width measurement 0.520" (13.21mm).
