Attribute
Description
Manufacturer Part Number
V2030N
Description
HEATSINK CPU FORGED
Manufacturer Lead Time
--

Our team will assist you shortly.

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design Assorted (BGA, LGA, CPU, ASIC...)
Mounting Technique Thermal Tape, Adhesive (Not Included)
Physical Shape Form Square, Pin Fins
Linear Length Dimension 0.984" (25.00mm)
Horizontal Width Dimension 0.984" (25.00mm)
Circular Measurement -
Heat Sink Fin Elevation 0.256" (6.50mm)
Power at Temp Increase -
Thermal Resistance with Fan -
Passive Cooling Resistance 6.00°C/W
Construction Material Type Aluminum Alloy
Surface Material Treatment Natural Anodized

Description

Fastened using a Thermal Tape, Adhesive (Not Included) method for dependable placement. Records the fin height at 0.256" (6.50mm). Overall length 0.984" (25.00mm) for size indication. Type of construction material Aluminum Alloy for durability and efficiency. Coating Natural Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package Assorted (BGA, LGA, CPU, ASIC...) aimed at cooling. Product status Active concerning availability and lifecycle. Shape Square, Pin Fins for the part or device. Thermal resistance in natural airflow 6.00°C/W for heat regulation. Type classification Top Mount for specifications. Horizontal width measurement 0.984" (25.00mm).