Stock:
Distributor: 116
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 9,576.59000 | ₹ 95,76,590.00 |
| 500 | ₹ 10,303.46000 | ₹ 51,51,730.00 |
| 210 | ₹ 11,129.68000 | ₹ 23,37,232.80 |
| 110 | ₹ 11,430.48000 | ₹ 12,57,352.80 |
| 100 | ₹ 12,083.65000 | ₹ 12,08,365.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10 | ₹ 10,568.45000 | ₹ 1,05,684.50 |
| 1 | ₹ 11,537.22000 | ₹ 11,537.22 |
Stock:
Distributor: 133
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 100 | ₹ 11,205.10000 | ₹ 11,20,510.00 |
Stock:
Distributor: 114
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 13,024.26000 | ₹ 13,024.26 |
| 5 | ₹ 12,246.40000 | ₹ 61,232.00 |
| 10 | ₹ 11,721.30000 | ₹ 1,17,213.00 |
| 25 | ₹ 11,239.81000 | ₹ 2,80,995.25 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | quadFLOW™ | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Device Type Classification | Top Mount, Zipper Fin | |
| Thermal Package Design | Intel LGA2011 & LGA2066 CPU Cooler | |
| Mounting Technique | Push Pin | |
| Physical Shape Form | Square, Fins | |
| Linear Length Dimension | 3.637" (92.38mm) | |
| Horizontal Width Dimension | 3.626" (92.11mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 1.142" (29.00mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Nickel |
Description
Fastened using a Push Pin method for dependable placement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Records the fin height at 1.142" (29.00mm). Overall length 3.637" (92.38mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Nickel for safeguarding and aesthetic enhancement. Type of housing Box for safeguarding or transporting components. Layout of the thermal management package Intel LGA2011 & LGA2066 CPU Cooler aimed at cooling. Product status Active concerning availability and lifecycle. Classification series for the product or component quadFLOW™. Shape Square, Fins for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Type classification Top Mount, Zipper Fin for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Horizontal width measurement 3.626" (92.11mm).
