Attribute
Description
Manufacturer Part Number
ATS-57003-C1-R0
Description
HEAT SINK 94MM X 94MM X 27MM
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design LGA
Mounting Technique Push Pin
Physical Shape Form Square, Fins
Linear Length Dimension 3.700" (94.00mm)
Horizontal Width Dimension 3.700" (93.98mm)
Circular Measurement -
Heat Sink Fin Elevation 1.063" (27.00mm)
Power at Temp Increase -
Thermal Resistance with Fan 1.40°C/W @ 200 LFM
Passive Cooling Resistance -
Construction Material Type Aluminum
Surface Material Treatment Black Anodized

Description

Fastened using a Push Pin method for dependable placement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Records the fin height at 1.063" (27.00mm). Overall length 3.700" (94.00mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package LGA aimed at cooling. Product status Active concerning availability and lifecycle. Shape Square, Fins for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Thermal resistance with fan assistance 1.40°C/W @ 200 LFM for enhanced cooling efficiency. Type classification Top Mount for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Horizontal width measurement 3.700" (93.98mm).