Attribute
Description
Manufacturer Part Number
3084
Description
MINI ALUMINUM HEAT SINK FOR RASP
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design Raspberry Pi, Raspberry Pi 3
Mounting Technique Thermal Tape, Adhesive (Included)
Physical Shape Form Square, Fins
Linear Length Dimension 0.512" (13.00mm)
Horizontal Width Dimension 0.512" (13.00mm)
Circular Measurement -
Heat Sink Fin Elevation 0.118" (3.00mm)
Power at Temp Increase -
Thermal Resistance with Fan -
Passive Cooling Resistance -
Construction Material Type Aluminum
Surface Material Treatment -

Description

Fastened using a Thermal Tape, Adhesive (Included) method for dependable placement. Records the fin height at 0.118" (3.00mm). Overall length 0.512" (13.00mm) for size indication. Type of construction material Aluminum for durability and efficiency. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package Raspberry Pi, Raspberry Pi 3 aimed at cooling. Product status Active concerning availability and lifecycle. Shape Square, Fins for the part or device. Type classification Top Mount for specifications. Horizontal width measurement 0.512" (13.00mm).