Manufacturer

BOYD LACONIA, LLC

Part Number	Manufacturer	Price	Product Series Line	IC Encapsulation Type	Availability Status	Device Type Classification	Mounting Technique	Physical Shape Form	Fan Power Consumption	Heat Dissipation Resistance	Braid Wick Material	Linear Length Dimension	Horizontal Width Dimension	Vertical Dimension	Circular Measurement	Ambient Temp Range	Key Product Highlights	Construction Material Type	Supported Hardware Platform
HP-CWS-F06X28-200-N BOYD LACONIA, LLC	BOYD LACONIA, LLC	-	-	Bulk	Active	Heat Pipe	Epoxy or Solder	Flat	31.0W @ 200mm	-	Sintered	7.874" (200.00mm)	0.315" (8.00mm)	0.110" (2.80mm)	-	-55°C ~ 180°C	-	Copper	-
HP-CWS-F05X20-100-N BOYD LACONIA, LLC	BOYD LACONIA, LLC	-	-	Bulk	Active	Heat Pipe	Epoxy or Solder	Flat	40.0W @ 100mm	-	Sintered	3.937" (100.00mm)	0.276" (7.00mm)	0.079" (2.00mm)	-	-55°C ~ 180°C	-	Copper	-
HP-CWS-F08X47-200-N BOYD LACONIA, LLC	BOYD LACONIA, LLC	-	-	Bulk	Active	Heat Pipe	Epoxy or Solder	Flat	75.0W @ 200mm	-	Sintered	7.874" (200.00mm)	0.394" (10.00mm)	0.185" (4.70mm)	-	-55°C ~ 180°C	-	Copper	-
HP-CWS-F08X47-075-N BOYD LACONIA, LLC	BOYD LACONIA, LLC	-	-	Bulk	Active	Heat Pipe	Epoxy or Solder	Flat	52.0W @ 75mm	-	Sintered	2.953" (75.00mm)	0.394" (10.00mm)	0.185" (4.70mm)	-	-55°C ~ 180°C	-	Copper	-
HP-CWS-R10-250-K BOYD LACONIA, LLC	BOYD LACONIA, LLC	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-