Attribute
Description
Manufacturer Part Number
24-C182-10
Manufacturer
Description
CONN IC DIP SOCKET 24POS GOLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 5000 | ₹ 347.10000 | ₹ 17,35,500.00 |
| 2500 | ₹ 352.44000 | ₹ 8,81,100.00 |
| 1000 | ₹ 361.34000 | ₹ 3,61,340.00 |
| 500 | ₹ 372.02000 | ₹ 1,86,010.00 |
| 250 | ₹ 387.15000 | ₹ 96,787.50 |
| 100 | ₹ 404.95000 | ₹ 40,495.00 |
| 50 | ₹ 423.64000 | ₹ 21,182.00 |
| 5 | ₹ 521.54000 | ₹ 2,607.70 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 414.53000 | ₹ 4,14,530.00 |
| 500 | ₹ 435.29000 | ₹ 2,17,645.00 |
| 250 | ₹ 457.09000 | ₹ 1,14,272.50 |
| 100 | ₹ 487.61000 | ₹ 48,761.00 |
| 50 | ₹ 512.06000 | ₹ 25,603.00 |
| 25 | ₹ 537.73000 | ₹ 13,443.25 |
| 10 | ₹ 573.70000 | ₹ 5,737.00 |
| 1 | ₹ 675.10000 | ₹ 675.10 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 569.60000 | ₹ 569.60 |
| 10 | ₹ 483.27000 | ₹ 4,832.70 |
| 25 | ₹ 453.01000 | ₹ 11,325.25 |
| 50 | ₹ 431.65000 | ₹ 21,582.50 |
| 100 | ₹ 411.18000 | ₹ 41,118.00 |
| 250 | ₹ 385.37000 | ₹ 96,342.50 |
| 500 | ₹ 366.68000 | ₹ 1,83,340.00 |
| 1000 | ₹ 339.09000 | ₹ 3,39,090.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | EJECT-A-DIP™ | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 24 (2 x 12) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 10.0µin (0.25µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Ambient Temp Range | -55°C ~ 105°C |
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