Attribute
Description
Manufacturer Part Number
225-PRS15001-12
Manufacturer
Description
CONN SOCKET PGA ZIF GOLD
Manufacturer Lead Time
8 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
100 ₹ 7,130.03000 ₹ 7,13,003.00
50 ₹ 7,373.42000 ₹ 3,68,671.00
25 ₹ 7,742.45000 ₹ 1,93,561.25
10 ₹ 8,259.15000 ₹ 82,591.50
1 ₹ 9,716.28000 ₹ 9,716.28

Stock:

Distributor: 110


Quantity Unit Price Ext. Price
50 ₹ 7,589.92000 ₹ 3,79,496.00
25 ₹ 7,798.18000 ₹ 1,94,954.50
15 ₹ 8,125.70000 ₹ 1,21,885.50
10 ₹ 8,250.30000 ₹ 82,503.00
5 ₹ 8,495.94000 ₹ 42,479.70
1 ₹ 9,181.24000 ₹ 9,181.24

Stock:

Distributor: 130


Quantity Unit Price Ext. Price
1 ₹ 8,352.17000 ₹ 8,352.17

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 9,112.71000 ₹ 9,112.71
10 ₹ 7,745.67000 ₹ 77,456.70
25 ₹ 7,330.04000 ₹ 1,83,251.00
50 ₹ 7,071.94000 ₹ 3,53,597.00

Stock:

Distributor: 121


Quantity Unit Price Ext. Price
1 ₹ 9,526.32000 ₹ 9,526.32
10 ₹ 9,492.72000 ₹ 94,927.20

Stock:

Distributor: 113


Quantity Unit Price Ext. Price
4 ₹ 14,235.55000 ₹ 56,942.20
4 ₹ 14,076.06000 ₹ 56,304.24
6 ₹ 13,982.61000 ₹ 83,895.66
8 ₹ 13,917.82000 ₹ 1,11,342.56
10 ₹ 13,710.98000 ₹ 1,37,109.80

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line PRS
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification PGA, ZIF (ZIP)
Grid Pin Array Count 225 (15 x 15)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 30.0µin (0.76µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Tin
Post Layer Depth 200.0µin (5.08µm)
Solder Tail Material Beryllium Copper
Casing Build Material Polyphenylene Sulfide (PPS)
Ambient Temp Range -65°C ~ 125°C