Attribute
Description
Manufacturer Part Number
225-PRS15001-12
Manufacturer
Description
CONN SOCKET PGA ZIF GOLD
Manufacturer Lead Time
8 weeks
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 100 | ₹ 7,130.03000 | ₹ 7,13,003.00 |
| 50 | ₹ 7,373.42000 | ₹ 3,68,671.00 |
| 25 | ₹ 7,742.45000 | ₹ 1,93,561.25 |
| 10 | ₹ 8,259.15000 | ₹ 82,591.50 |
| 1 | ₹ 9,716.28000 | ₹ 9,716.28 |
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 7,589.92000 | ₹ 3,79,496.00 |
| 25 | ₹ 7,798.18000 | ₹ 1,94,954.50 |
| 15 | ₹ 8,125.70000 | ₹ 1,21,885.50 |
| 10 | ₹ 8,250.30000 | ₹ 82,503.00 |
| 5 | ₹ 8,495.94000 | ₹ 42,479.70 |
| 1 | ₹ 9,181.24000 | ₹ 9,181.24 |
Stock:
Distributor: 130
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 8,352.17000 | ₹ 8,352.17 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 9,112.71000 | ₹ 9,112.71 |
| 10 | ₹ 7,745.67000 | ₹ 77,456.70 |
| 25 | ₹ 7,330.04000 | ₹ 1,83,251.00 |
| 50 | ₹ 7,071.94000 | ₹ 3,53,597.00 |
Stock:
Distributor: 121
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 9,526.32000 | ₹ 9,526.32 |
| 10 | ₹ 9,492.72000 | ₹ 94,927.20 |
Stock:
Distributor: 113
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 4 | ₹ 14,235.55000 | ₹ 56,942.20 |
| 4 | ₹ 14,076.06000 | ₹ 56,304.24 |
| 6 | ₹ 13,982.61000 | ₹ 83,895.66 |
| 8 | ₹ 13,917.82000 | ₹ 1,11,342.56 |
| 10 | ₹ 13,710.98000 | ₹ 1,37,109.80 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | PRS | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | PGA, ZIF (ZIP) | |
| Grid Pin Array Count | 225 (15 x 15) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 30.0µin (0.76µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Beryllium Copper | |
| Casing Build Material | Polyphenylene Sulfide (PPS) | |
| Ambient Temp Range | -65°C ~ 125°C |
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