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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Storage Capacity Electrical | 33pF | |
| Rated Operating Voltage | 50V | |
| Accuracy Tolerance Percentage | ±10% | |
| Temp Drift Factor | SL | |
| Attachment Mounting Style | Through Hole | |
| Ambient Temp Range | -30°C ~ 85°C | |
| Component Housing Style | Radial, Disc | |
| Package Size Specs | 0.157" Dia (4.00mm) | |
| Maximum Mounted Height | 0.236" (6.00mm) | |
| Maximum Thickness Limit | - | |
| Pin Lead Gap | 0.098" (2.50mm) | |
| Reliability Failure Metric | - | |
| Wire Lead Configuration | Straight |
Description
Provides a capacitance level rated at 33pF to maintain circuit stability. Assesses resistance at forward current SL for LED or diode testing. Maximum installed height of 0.236" (6.00mm) for components affixed to the board. Lead spacing 0.098" (2.50mm) to meet PCB design requirements. Configured with Straight lead style for reliable connectivity. Mounting configuration Through Hole for structural stability. Temperature range -30°C ~ 85°C for environmental conditions impacting thermal efficiency. Style of the enclosure/case Radial, Disc that offers mechanical and thermal protection. Details on package size 0.157" Dia (4.00mm) for electrical or mechanical components. Measurement dimensions 0.157" Dia (4.00mm) for component specifications. The temperature drift factor SL that guarantees performance consistency. Precision tolerance level ±10% in manufacturing processes. Maximum Vce(on) at Vge 33pF for transistor specifications. The operating voltage rating of the device 50V.
