Attribute
Description
Manufacturer Part Number
MMC16.5685K50C31TR24
Manufacturer
Description
CAP FILM 6.8UF 10% 50VDC 6560
Manufacturer Lead Time
50 weeks

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line MMC
IC Encapsulation Type Tape & Reel (TR)
Availability Status Obsolete
Storage Capacity Electrical 6.8 µF
Accuracy Tolerance Percentage ±10%
AC Voltage Max 30V
DC Voltage Max 50V
Insulating Dielectric Type Polyester, Metallized
Series Resistance Equivalent -
Ambient Temp Range -55°C ~ 100°C
Attachment Mounting Style Surface Mount
Component Housing Style 6560 (165150 Metric)
Package Size Specs 0.650" L x 0.591" W (16.50mm x 15.00mm)
Maximum Mounted Height 0.283" (7.20mm)
Circuit End Method Solder Pads
Pin Lead Gap -
Intended Uses General Purpose
Performance Rating Specs -
Key Product Highlights -

Description

Perfectly designed for situations involving General Purpose. Provides a capacitance level rated at 6.8 µF to maintain circuit stability. Constructed with dielectric material specified as Polyester, Metallized. Maximum installed height of 0.283" (7.20mm) for components affixed to the board. Mounting configuration Surface Mount for structural stability. Temperature range -55°C ~ 100°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 6560 (165150 Metric) that offers mechanical and thermal protection. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component MMC. Details on package size 0.650" L x 0.591" W (16.50mm x 15.00mm) for electrical or mechanical components. Measurement dimensions 0.650" L x 0.591" W (16.50mm x 15.00mm) for component specifications. Termination method Solder Pads for electrical or mechanical connections. Precision tolerance level ±10% in manufacturing processes. The highest AC voltage specification 30V for the device. The highest DC voltage specification 50V for components.