Product Attributes

Type	Description	Select All
Category	Breadboards PCBs and Fabrication Tools Breakout Adapter Boards
Import Duty Classification	-
Product Series Line	-
IC Encapsulation Type	Bulk
Availability Status	Active
Prototype Board Style	SMD to Plated Through Hole
Supported Package Formats	-
Switch Position Options	-
Component Spacing Distance	0.100" (2.54mm)
Circuit Board Depth	0.062" (1.57mm) 1/16"
Construction Material Type	FR4 Epoxy Glass
Package Size Specs	4.500" L x 1.600" W (114.30mm x 40.64mm)

Description

Features a thickness of 0.062" (1.57mm) 1/16" to ensure strong structural integrity. Type of construction material FR4 Epoxy Glass for durability and efficiency. Type of housing Bulk for safeguarding or transporting components. Distance 0.100" (2.54mm) for arranging components or aligning connectors. Product status Active concerning availability and lifecycle. Design of prototype board SMD to Plated Through Hole for development tasks. Details on package size 4.500" L x 1.600" W (114.30mm x 40.64mm) for electrical or mechanical components. Measurement dimensions 4.500" L x 1.600" W (114.30mm x 40.64mm) for component specifications.