Attribute
Description
Manufacturer Part Number
5-8-NL-LOGIC-EVM
Manufacturer
Description
PROTOTYPE
Manufacturer Lead Time
53 weeks

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Prototype Board Style Plated Through Hole to Plated Through Hole
Supported Package Formats -
Switch Position Options -
Component Spacing Distance -
Circuit Board Depth 0.063" (1.60mm)
Construction Material Type FR4 Epoxy Glass
Package Size Specs -

Description

Features a thickness of 0.063" (1.60mm) to ensure strong structural integrity. Type of construction material FR4 Epoxy Glass for durability and efficiency. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Design of prototype board Plated Through Hole to Plated Through Hole for development tasks.