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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Prototype Board Style | SMD to Plated Through Hole Board | |
| Supported Package Formats | SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP | |
| Switch Position Options | 6, 8 | |
| Component Spacing Distance | 0.020" (0.50mm) | |
| Circuit Board Depth | - | |
| Construction Material Type | - | |
| Package Size Specs | 3.937" L x 3.150" W (100.00mm x 80.00mm) |
Description
Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Overall number of positions 6, 8 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Accepted package formats SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP for manufacturing or assembly. Distance 0.020" (0.50mm) for arranging components or aligning connectors. Product status Obsolete concerning availability and lifecycle. Design of prototype board SMD to Plated Through Hole Board for development tasks. Details on package size 3.937" L x 3.150" W (100.00mm x 80.00mm) for electrical or mechanical components. Measurement dimensions 3.937" L x 3.150" W (100.00mm x 80.00mm) for component specifications. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
