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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Proto-Advantage | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Prototype Board Style | Plated Through Hole to Plated Through Hole | |
| Supported Package Formats | - | |
| Switch Position Options | 10 | |
| Component Spacing Distance | 0.050" (1.27mm) | |
| Circuit Board Depth | 0.063" (1.60mm) | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | 1.100" L x 0.400" W (27.94mm x 10.16mm) |
Description
Features a thickness of 0.063" (1.60mm) to ensure strong structural integrity. Type of construction material FR4 Epoxy Glass for durability and efficiency. Overall number of positions 10 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Distance 0.050" (1.27mm) for arranging components or aligning connectors. Product status Active concerning availability and lifecycle. Design of prototype board Plated Through Hole to Plated Through Hole for development tasks. Classification series for the product or component Proto-Advantage. Details on package size 1.100" L x 0.400" W (27.94mm x 10.16mm) for electrical or mechanical components. Measurement dimensions 1.100" L x 0.400" W (27.94mm x 10.16mm) for component specifications.
