Attribute
Description
Manufacturer Part Number
CPG-05-N-B
Manufacturer
Description
POGOPIN,
SOLID NEEDLE,
1.55MM HE
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | CPG | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Pin Interface Category | Contact Pad | |
| Attachment Mounting Style | Surface Mount | |
| Top Operational Elevation | - | |
| Optimal Use Elevation | - | |
| Lowest Operational Elevation | - | |
| Solder Pad Size | Circular - 0.059" (1.50mm) Dia, 0.061" (1.55mm) H | |
| Starting Actuation Force | - | |
| Mid-Stroke Force | - | |
| Actuator Plunger Dimension | - | |
| Key Product Highlights | - | |
| Connection Durability Cycles | - | |
| Pin Alloy Composition | Brass Alloy | |
| Pin Surface Treatment | Gold | |
| Pin Coating Depth | 20.0µin (0.51µm) | |
| Ampere Capacity Rating | - |
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