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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Interface Connector Category | DIP, DIL - Header | |
| Pin Interface Category | Post | |
| Switch Position Options | 8 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Grid Row Count | 2 | |
| Row Pin Gap | 0.300" (7.62mm) | |
| Attachment Mounting Style | Through Hole | |
| Circuit End Method | Solder | |
| Key Product Highlights | - | |
| Pin Surface Treatment | Gold | |
| Pin Coating Depth | 10.0µin (0.25µm) | |
| Visual Hue | - |
Description
Features a connector type acknowledged as DIP, DIL - Header. Includes contact finish plated at Gold to improve conductivity. Represents the thickness of the contact finish recorded at 10.0µin (0.25µm). Makes use of a contact type known as Post. Mounting configuration Through Hole for structural stability. Overall number of positions 8 for switches or mechanical components. Overall rows 2 for setting up matrices or displays. Type of housing Bulk for safeguarding or transporting components. Distance 0.100" (2.54mm) for arranging components or aligning connectors. Product status Obsolete concerning availability and lifecycle. The 0.300" (7.62mm) spacing between rows for connectors or PCB layout. Termination method Solder for electrical or mechanical connections.
