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16 Results

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ARIES ELECTRONICS

Part Number	Manufacturer	Price	Product Series Line	IC Encapsulation Type	Availability Status	Source Adapter Interface	Target Adapter Interface	IC Pin Total	Mating Connector Pitch	Engaging Pin Coating	Attachment Mounting Style	Circuit End Method	Post Pin Interval	Post-Contact Pin Layer	Casing Build Material	Circuit Board Substrate
32-450001-10 ARIES ELECTRONICS	ARIES ELECTRONICS	₹4,418.73	Correct-A-Chip® 450001	Bulk	Active	SOJ	DIP, 0.4" (10.16mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	FR4 Epoxy Glass
16-35W000-11-RC-P (220 UP) ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip® 35W000	Bulk	-	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
16-307349-11-RC-P (170 UP) ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip® 307349	Bulk	-	PLCC	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
48-655000-10 ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip® 655000	Bulk	Obsolete	TSOP	DIP, 0.6" (15.24mm) Row Spacing	48	0.020" (0.50mm)	Silver	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
56-184M65 ARIES ELECTRONICS	ARIES ELECTRONICS	-	-	-	Obsolete	QFP	PGA	184	-	-	-	-	-	-	-	-
28-651000-11-RC ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip® 651000	Tube	Obsolete	SSOP	DIP, 0.6" (15.24mm) Row Spacing	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
96-100M65 ARIES ELECTRONICS	ARIES ELECTRONICS	-	-	-	Obsolete	QFP	PGA	100	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
96-128M80 ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip®	-	Obsolete	QFP	PGA	128	0.031" (0.80mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-652000-10 ARIES ELECTRONICS	ARIES ELECTRONICS	₹4,670.07	Correct-A-Chip® 652000	Bulk	Active	PLCC	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
95-100I25 ARIES ELECTRONICS	ARIES ELECTRONICS	-	-	-	Obsolete	QFP	PGA	100	0.025" (0.64mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
64-304121-00 ARIES ELECTRONICS	ARIES ELECTRONICS	-	-	-	Obsolete	TQFP	QFP	64	0.031" (0.80mm)	-	Through Hole	Solder	0.031" (0.80mm)	Tin-Lead	-	FR4 Epoxy Glass
96-080M80 ARIES ELECTRONICS	ARIES ELECTRONICS	-	-	-	Obsolete	QFP	PGA	80	0.031" (0.80mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
32-653000-11-RC ARIES ELECTRONICS	ARIES ELECTRONICS	₹3,565.64	Correct-A-Chip® 653000	Bulk	Active	PLCC	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
32-354000-10 ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip® 354000	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	SOIC	32	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-353000-10 ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip® 353000	Bulk	Active	PLCC	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin-Lead	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1111163 ARIES ELECTRONICS	ARIES ELECTRONICS	-	Correct-A-Chip® 1111163	Bulk	Active	Socket, 0.6" (15.24mm) Row Spacing	PLCC	40	-	Gold	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	FR4 Epoxy Glass