Attribute
Description
Manufacturer Part Number
3020-08-0300-00
Manufacturer
Description
CONN HEADER SMD 8POS 2.54MM
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50400 | ₹ 23.07000 | ₹ 11,62,728.00 |
| 25200 | ₹ 23.42000 | ₹ 5,90,184.00 |
| 9000 | ₹ 24.02000 | ₹ 2,16,180.00 |
| 5400 | ₹ 24.39000 | ₹ 1,31,706.00 |
| 3600 | ₹ 25.41000 | ₹ 91,476.00 |
| 1800 | ₹ 25.80000 | ₹ 46,440.00 |
| 500 | ₹ 28.71000 | ₹ 14,355.00 |
| 50 | ₹ 34.23000 | ₹ 1,711.50 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1800 | ₹ 29.27000 | ₹ 52,686.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Interface Connector Category | Header | |
| Pin Interface Category | Male Pin | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Switch Position Options | 8 | |
| Grid Row Count | 2 | |
| Mating Row Interval | 0.100" (2.54mm) | |
| Populated Position Count | All | |
| Design Style Variant | Board to Cable/Wire | |
| Connector Shroud Coverage | Shrouded - 4 Wall | |
| Attachment Mounting Style | Surface Mount | |
| Circuit End Method | Solder | |
| Secure Attachment Method | Push-Pull | |
| Engagement Pin Length | - | |
| Tail Pin Extension | - | |
| Full Pin Contact Span | - | |
| Barrier Wall Height | 0.354" (9.00mm) | |
| Pin Profile Design | Square | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | Flash | |
| Post-Contact Pin Layer | Gold | |
| Pin Alloy Composition | Brass | |
| Dielectric Insulation Type | Polyamide (PA9T), Nylon 9T | |
| Key Product Highlights | Keying Slot | |
| Ambient Temp Range | -40°C ~ 105°C | |
| Dust Water Resistance Rating | - | |
| Fire Resistance Classification | UL94 V-0 | |
| Covering Wire Hue | Black | |
| Ampere Capacity Rating | 3A (AC/DC) | |
| Max Voltage Specification | - |
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