Attribute
Description
Manufacturer Part Number
210-1-28-006
Manufacturer
Description
CONN IC DIP SOCKET 28POS GOLD
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1700 | ₹ 102.35000 | ₹ 1,73,995.00 |
| 1275 | ₹ 105.02000 | ₹ 1,33,900.50 |
| 850 | ₹ 132.61000 | ₹ 1,12,718.50 |
| 425 | ₹ 215.38000 | ₹ 91,536.50 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2516 | ₹ 116.54000 | ₹ 2,93,214.64 |
| 1003 | ₹ 124.35000 | ₹ 1,24,723.05 |
| 510 | ₹ 130.42000 | ₹ 66,514.20 |
| 255 | ₹ 136.96000 | ₹ 34,924.80 |
| 102 | ₹ 146.12000 | ₹ 14,904.24 |
| 51 | ₹ 153.45000 | ₹ 7,825.95 |
| 34 | ₹ 157.90000 | ₹ 5,368.60 |
| 17 | ₹ 165.83000 | ₹ 2,819.11 |
| 1 | ₹ 202.83000 | ₹ 202.83 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.6" (15.24mm) Row Spacing | |
| Grid Pin Array Count | 28 (2 x 14) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -40°C ~ 105°C |
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