Attribute
Description
Manufacturer Part Number
210-1-20-003
Manufacturer
Description
CONN IC DIP SOCKET 20POS GOLD
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2400 | ₹ 75.12000 | ₹ 1,80,288.00 |
| 1800 | ₹ 76.63000 | ₹ 1,37,934.00 |
| 1200 | ₹ 96.83000 | ₹ 1,16,196.00 |
| 600 | ₹ 157.35000 | ₹ 94,410.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 4800 | ₹ 83.84000 | ₹ 4,02,432.00 |
| 2400 | ₹ 88.04000 | ₹ 2,11,296.00 |
| 500 | ₹ 98.34000 | ₹ 49,170.00 |
| 250 | ₹ 103.27000 | ₹ 25,817.50 |
| 100 | ₹ 110.17000 | ₹ 11,017.00 |
| 50 | ₹ 115.70000 | ₹ 5,785.00 |
| 25 | ₹ 121.50000 | ₹ 3,037.50 |
| 10 | ₹ 129.67000 | ₹ 1,296.70 |
| 1 | ₹ 152.50000 | ₹ 152.50 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 20 (2 x 10) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -40°C ~ 105°C |
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