Attribute
Description
Manufacturer Part Number
210-1-18-003
Manufacturer
Description
CONN IC DIP SOCKET 18POS GOLD
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2600 | ₹ 65.15000 | ₹ 1,69,390.00 |
| 1950 | ₹ 66.48000 | ₹ 1,29,636.00 |
| 1300 | ₹ 84.02000 | ₹ 1,09,226.00 |
| 650 | ₹ 136.53000 | ₹ 88,744.50 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2522 | ₹ 77.05000 | ₹ 1,94,320.10 |
| 1014 | ₹ 82.16000 | ₹ 83,310.24 |
| 520 | ₹ 86.13000 | ₹ 44,787.60 |
| 260 | ₹ 90.45000 | ₹ 23,517.00 |
| 104 | ₹ 96.50000 | ₹ 10,036.00 |
| 52 | ₹ 101.34000 | ₹ 5,269.68 |
| 26 | ₹ 106.43000 | ₹ 2,767.18 |
| 10 | ₹ 113.88000 | ₹ 1,138.80 |
| 1 | ₹ 133.77000 | ₹ 133.77 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 18 (2 x 9) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -40°C ~ 105°C |
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