Attribute
Description
Manufacturer Part Number
210-1-16-003
Manufacturer
Description
CONN IC DIP SOCKET 16POS GOLD
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 110
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 3000 | ₹ 58.56000 | ₹ 1,75,680.00 |
| 2250 | ₹ 59.72000 | ₹ 1,34,370.00 |
| 1500 | ₹ 75.47000 | ₹ 1,13,205.00 |
| 750 | ₹ 122.64000 | ₹ 91,980.00 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2520 | ₹ 69.68000 | ₹ 1,75,593.60 |
| 1020 | ₹ 74.27000 | ₹ 75,755.40 |
| 510 | ₹ 78.00000 | ₹ 39,780.00 |
| 270 | ₹ 81.58000 | ₹ 22,026.60 |
| 120 | ₹ 86.39000 | ₹ 10,366.80 |
| 60 | ₹ 90.72000 | ₹ 5,443.20 |
| 30 | ₹ 95.28000 | ₹ 2,858.40 |
| 10 | ₹ 103.02000 | ₹ 1,030.20 |
| 1 | ₹ 120.99000 | ₹ 120.99 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 16 (2 x 8) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -40°C ~ 105°C |
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