Attribute
Description
Manufacturer Part Number
44-547-11
Manufacturer
Description
CONN SOCKET SOIC ZIF 44POS GOLD
Manufacturer Lead Time
8 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 110

Quantity Unit Price Ext. Price
10 ₹ 20,429.06000 ₹ 2,04,290.60
5 ₹ 20,740.56000 ₹ 1,03,702.80
3 ₹ 21,056.51000 ₹ 63,169.53
1 ₹ 21,658.15000 ₹ 21,658.15

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
25 ₹ 21,736.27000 ₹ 5,43,406.75
10 ₹ 22,882.38000 ₹ 2,28,823.80
1 ₹ 26,915.73000 ₹ 26,915.73

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 547
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification SOIC, ZIF (ZIP)
Grid Pin Array Count 44 (2 x 22)
Mating Connector Pitch -
Engaging Pin Coating Gold
Engagement Layer Thickness 20.0µin (0.51µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.050" (1.27mm)
Post-Contact Pin Layer Gold
Post Layer Depth 20.0µin (0.51µm)
Solder Tail Material Beryllium Copper
Casing Build Material Polyphenylene Sulfide (PPS), Glass Filled
Ambient Temp Range -

Description

Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 20.0µin (0.51µm). Constructed with the thickness of the post finish evaluated at 20.0µin (0.51µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Beryllium Copper. Equipped with features categorized as Closed Frame. Constructed from Polyphenylene Sulfide (PPS), Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 44 (2 x 22) for connector layout. Type of housing Bulk for safeguarding or transporting components. The space between posts 0.050" (1.27mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component 547. Termination method Solder for electrical or mechanical connections. Type classification SOIC, ZIF (ZIP) for specifications.