Attribute
Description
Manufacturer Part Number
24-516-11
Manufacturer
Description
CONN IC DIP SOCKET ZIF 24POS GLD
Manufacturer Lead Time
8 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 110

Quantity Unit Price Ext. Price
1005 ₹ 875.76000 ₹ 8,80,138.80
510 ₹ 903.35000 ₹ 4,60,708.50
255 ₹ 930.94000 ₹ 2,37,389.70
105 ₹ 966.54000 ₹ 1,01,486.70
60 ₹ 988.79000 ₹ 59,327.40
30 ₹ 1,017.27000 ₹ 30,518.10
15 ₹ 1,044.86000 ₹ 15,672.90

Stock:

Distributor: 115


Quantity Unit Price Ext. Price
1005 ₹ 875.76000 ₹ 8,80,138.80
510 ₹ 903.35000 ₹ 4,60,708.50
255 ₹ 930.94000 ₹ 2,37,389.70
105 ₹ 966.54000 ₹ 1,01,486.70
60 ₹ 988.79000 ₹ 59,327.40
30 ₹ 1,017.27000 ₹ 30,518.10
15 ₹ 1,044.86000 ₹ 15,672.90

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
30 ₹ 1,173.32000 ₹ 35,199.60
15 ₹ 1,224.92000 ₹ 18,373.80

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
30 ₹ 1,294.17000 ₹ 38,825.10

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 1,343.01000 ₹ 1,343.01
10 ₹ 1,318.09000 ₹ 13,180.90
60 ₹ 1,035.07000 ₹ 62,104.20
105 ₹ 1,015.49000 ₹ 1,06,626.45
255 ₹ 997.69000 ₹ 2,54,410.95
510 ₹ 983.45000 ₹ 5,01,559.50

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 516
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, ZIF (ZIP)
Grid Pin Array Count 24 (2 x 12)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 10.0µin (0.25µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth 10.0µin (0.25µm)
Solder Tail Material Beryllium Copper
Casing Build Material Polyamide (PA46), Nylon 4/6, Glass Filled
Ambient Temp Range -

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 10.0µin (0.25µm). Constructed with the thickness of the post finish evaluated at 10.0µin (0.25µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Beryllium Copper. Equipped with features categorized as Closed Frame. Constructed from Polyamide (PA46), Nylon 4/6, Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 24 (2 x 12) for connector layout. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component 516. Termination method Solder for electrical or mechanical connections. Type classification DIP, ZIF (ZIP) for specifications.