Attribute
Description
Manufacturer Part Number
18-8750-310C
Manufacturer
Description
CONN IC DIP SOCKET 18POS GOLD
Manufacturer Lead Time
8 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 110

Quantity Unit Price Ext. Price
1000 ₹ 769.85000 ₹ 7,69,850.00
500 ₹ 781.42000 ₹ 3,90,710.00
250 ₹ 802.78000 ₹ 2,00,695.00
100 ₹ 849.95000 ₹ 84,995.00
50 ₹ 874.87000 ₹ 43,743.50
25 ₹ 915.81000 ₹ 22,895.25
5 ₹ 1,011.04000 ₹ 5,055.20

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 1,070.67000 ₹ 1,070.67
10 ₹ 1,027.06000 ₹ 10,270.60
25 ₹ 941.62000 ₹ 23,540.50
50 ₹ 929.16000 ₹ 46,458.00
100 ₹ 921.15000 ₹ 92,115.00
250 ₹ 894.45000 ₹ 2,23,612.50
500 ₹ 879.32000 ₹ 4,39,660.00

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
34 ₹ 1,073.90000 ₹ 36,512.60

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 8
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 18 (2 x 9)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 30.0µin (0.76µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame, Elevated
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth 10.0µin (0.25µm)
Solder Tail Material Brass
Casing Build Material Polyamide (PA46), Nylon 4/6, Glass Filled
Ambient Temp Range -55°C ~ 105°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 30.0µin (0.76µm). Constructed with the thickness of the post finish evaluated at 10.0µin (0.25µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Brass. Equipped with features categorized as Closed Frame, Elevated. Constructed from Polyamide (PA46), Nylon 4/6, Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 18 (2 x 9) for connector layout. Temperature range -55°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component 8. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.3" (7.62mm) Row Spacing for specifications.