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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Buchanan | |
| IC Encapsulation Type | Box | |
| Availability Status | Obsolete | |
| Device Type Classification | Header, Male Pins, Shrouded (2 Side) | |
| Switch Position Options | 2 | |
| Tier Position Quantity | 2 | |
| Voltage Level Tiers | 1 | |
| Component Spacing Distance | 0.197" (5.00mm) | |
| Pin Header Alignment | 90°, Right Angle | |
| Wire Insertion Angle | - | |
| Lead Termination Type | Solder | |
| Attachment Mounting Style | Through Hole | |
| IEC Standard Current | - | |
| IEC Standard Voltage | - | |
| UL Certified Current | 15 A | |
| UL Approved Voltage | 300 V | |
| AWG Wire Range | - | |
| Metric Wire Cross-Section Range | - | |
| Visual Hue | Gray | |
| Ambient Temp Range | -40°C ~ 110°C | |
| Pin Engagement Polish | Tin | |
| Key Product Highlights | Side Stacking |
Description
Offered in a shade referred to as Gray to enhance the system's aesthetics. Provides a contact mating finish classified as Tin. Meets UL current specifications classified as 15 A. Equipped with features categorized as Side Stacking. Ensures a header alignment of 90°, Right Angle for precise placement on the board. Mounting configuration Through Hole for structural stability. Overall levels 1 for multi-tier systems. Overall number of positions 2 for switches or mechanical components. Temperature range -40°C ~ 110°C for environmental conditions impacting thermal efficiency. Type of housing Box for safeguarding or transporting components. Distance 0.197" (5.00mm) for arranging components or aligning connectors. Positions available at each tier 2 for mechanical or electrical configurations. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component Buchanan. Type of termination Solder for connector or device. Type classification Header, Male Pins, Shrouded (2 Side) for specifications. UL certified voltage 300 V that has been approved.