Attribute
Description
Manufacturer Part Number
1542656-2
Manufacturer
Description
CONN HEAT SINK FOR XFP CONN
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | ChipCoolers | |
| IC Encapsulation Type | Box | |
| Component Accessory Category | Heat Sink | |
| Matching Accessory Items | XFP Connectors |
Description
Appropriate for accessories categorized as Heat Sink for system improvement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Designed for related items marked as XFP Connectors. Type of housing Box for safeguarding or transporting components. Classification series for the product or component ChipCoolers. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD