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184 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

MILL-MAX MANUFACTURING CORP

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
MILL-MAX MANUFACTURING CORP
-
540
Tube
Obsolete
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
MILL-MAX MANUFACTURING CORP
-
540
Tube
Obsolete
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
MILL-MAX MANUFACTURING CORP
-
940
Tube
Obsolete
PLCC
84 (4 x 21)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
540
Tube
Obsolete
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
MILL-MAX MANUFACTURING CORP
-
540
Tube
Obsolete
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
MILL-MAX MANUFACTURING CORP
-
540
Tube
Obsolete
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin-Lead
200.0µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
MILL-MAX MANUFACTURING CORP
-
940
Tube
Obsolete
PLCC
28 (4 x 7)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
510
Bulk
Active
PGA
84 (10 x 10)
0.100" (2.54mm)
-
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
510
Tube
Active
PGA
12 (5 x 5)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
510
Bulk
Active
PGA
88 (12 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
510
Bulk
Active
PGA
44 (8 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
510
Bulk
Active
PGA
64 (10 x 10)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
117
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.070" (1.78mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.070" (1.78mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
510
Bulk
Active
PGA
85 (11 x 11)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
122
Tube
Obsolete
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Wire Wrap
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
110
Tube
Obsolete
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
117
Tube
Active
DIP, 0.4" (10.16mm) Row Spacing
28 (2 x 14)
0.070" (1.78mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.070" (1.78mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
510
Bulk
Active
PGA
32 (9 x 9)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
117
Tube
Active
DIP, 0.75" (19.05mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.070" (1.78mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
MILL-MAX MANUFACTURING CORP
-
123
Tube
Obsolete
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Wire Wrap
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
...