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67 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

HARWIN INC

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
HARWIN INC
-
D01-997
Tube
Active
SIP
14 (1 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
16 (1 x 16)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Bulk
Obsolete
SIP
7 (1 x 7)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-997
Tube
Active
SIP
11 (1 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Bulk
Obsolete
SIP
12 (1 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-997
Tube
Active
SIP
15 (1 x 15)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Bulk
Obsolete
SIP
4 (1 x 4)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Bulk
Obsolete
SIP
18 (1 x 18)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
8 (1 x 8)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-995
Tube
Active
SIP
12 (1 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-997
Tube
Active
SIP
13 (1 x 13)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
14 (1 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D0
Bulk
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
5 (1 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-950
Tube
Obsolete
SIP
9 (1 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
HARWIN INC
-
D01-995
Tube
Active
SIP
5 (1 x 5)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C