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49 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

HARWIN

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
img
D0814-42 HARWIN
HARWIN
₹84.10
D0
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D95008-42 HARWIN
HARWIN
₹105.02
D95
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D2616-42 HARWIN
HARWIN
₹137.03
D26
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D0828-42 HARWIN
HARWIN
₹226.53
D0
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D0820-42 HARWIN
HARWIN
₹288.92
D0
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D2818-42 HARWIN
HARWIN
₹91.67
D2
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
img
D01-9970442 HARWIN
HARWIN
₹24.47
D01-997
Tube
Active
SIP
4 (1 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D01-9971042 HARWIN
HARWIN
₹56.43
D01-997
Tube
Active
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D2922-42 HARWIN
HARWIN
₹138.84
D2
Tube
Active
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
img
D2806-42 HARWIN
HARWIN
₹27.95
D2
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
img
D2928-42 HARWIN
HARWIN
₹147.74
D2
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
img
D01-9950442 HARWIN
HARWIN
₹44.64
D01-995
Tube
Active
SIP
4 (1 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D0818-42 HARWIN
HARWIN
₹145.74
D0
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D01-9933246 HARWIN
HARWIN
₹558.74
D01-993
Bulk
Active
SIP
32 (1 x 32)
0.100" (2.54mm)
Tin
-
Brass
Through Hole
-
Solder Cup
0.100" (2.54mm)
Tin
-
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
img
D01-9970242 HARWIN
HARWIN
₹21.13
D01-997
Bag
Active
SIP
2 (1 x 2)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Threaded
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D01-9951442 HARWIN
HARWIN
₹221.61
D01-995
Tube
Active
SIP
14 (1 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D2820-42 HARWIN
HARWIN
₹99.01
D2
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
img
D01-9972042 HARWIN
HARWIN
₹89.89
D01-997
Tube
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D01-9952042 HARWIN
HARWIN
₹300.82
D01-995
Bulk
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
img
D8864-42 HARWIN
HARWIN
₹516.20
D8864
Tube
Active
DIP, 0.75" (19.05mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
196.9µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
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