Attribute
Description
Manufacturer Part Number
IC201-1444-026N-2
Description
144 PIN QFP, 0.50 MM
Manufacturer Lead Time
1 week
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Stock:

Distributor: 108

Quantity Unit Price Ext. Price
1 ₹ 13,053.63000 ₹ 13,053.63
10 ₹ 10,521.58000 ₹ 1,05,215.80
30 ₹ 10,310.65000 ₹ 3,09,319.50
50 ₹ 10,045.43000 ₹ 5,02,271.50

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line IC
IC Encapsulation Type Tray
Availability Status Active
Device Type Classification QFP
Grid Pin Array Count 144
Mating Connector Pitch 0.020" (0.50mm)
Engaging Pin Coating Gold
Engagement Layer Thickness -
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.020" (0.50mm)
Post-Contact Pin Layer -
Post Layer Depth -
Solder Tail Material -
Casing Build Material Polyphenylene Sulfide (PPS), Glass Filled
Ambient Temp Range -40°C ~ 170°C

Description

Specifies connector spacing defined as 0.020" (0.50mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Utilizes the mating contact material designated as Beryllium Copper. Equipped with features categorized as Closed Frame. Constructed from Polyphenylene Sulfide (PPS), Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 144 for connector layout. Temperature range -40°C ~ 170°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. The distance 0.020" (0.50mm) to achieve correct alignment with the corresponding connector. The space between posts 0.020" (0.50mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component IC. Termination method Solder for electrical or mechanical connections. Type classification QFP for specifications.