Attribute
Description
Manufacturer Part Number
2-641606-2
Manufacturer
Description
CONN IC DIP SOCKET 40POS GOLD
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 110

Quantity Unit Price Ext. Price
5000 ₹ 259.88000 ₹ 12,99,400.00
1000 ₹ 364.37000 ₹ 3,64,370.00
500 ₹ 366.24000 ₹ 1,83,120.00
100 ₹ 403.44000 ₹ 40,344.00
25 ₹ 534.53000 ₹ 13,363.25
10 ₹ 662.16000 ₹ 6,621.60

Stock:

Distributor: 115


Quantity Unit Price Ext. Price
5000 ₹ 259.88000 ₹ 12,99,400.00
1000 ₹ 364.37000 ₹ 3,64,370.00
500 ₹ 366.24000 ₹ 1,83,120.00
100 ₹ 403.44000 ₹ 40,344.00
25 ₹ 534.53000 ₹ 13,363.25
10 ₹ 662.16000 ₹ 6,621.60

Stock:

Distributor: 118


Quantity Unit Price Ext. Price
3 ₹ 363.12000 ₹ 1,089.36
1 ₹ 544.68000 ₹ 544.68

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
30 ₹ 665.28000 ₹ 19,958.40
10 ₹ 838.18000 ₹ 8,381.80

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Diplomate DL
IC Encapsulation Type Tube
Availability Status Obsolete
Device Type Classification DIP, 0.6" (15.24mm) Row Spacing
Grid Pin Array Count 40 (2 x 20)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 30.0µin (0.76µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Open Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Gold
Post Layer Depth 30.0µin (0.76µm)
Solder Tail Material Beryllium Copper
Casing Build Material Thermoplastic, Glass Filled
Ambient Temp Range -55°C ~ 125°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 30.0µin (0.76µm). Constructed with the thickness of the post finish evaluated at 30.0µin (0.76µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Beryllium Copper. Equipped with features categorized as Open Frame. Constructed from Thermoplastic, Glass Filled material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 40 (2 x 20) for connector layout. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component Diplomate DL. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.6" (15.24mm) Row Spacing for specifications.