Attribute
Description
Manufacturer Part Number
110-43-308-41-001000
Manufacturer
Description
CONN IC DIP SOCKET 8POS GOLD
Manufacturer Lead Time
6 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 122

Quantity Unit Price Ext. Price
2500 ₹ 49.06000 ₹ 1,22,650.00
1000 ₹ 50.58000 ₹ 50,580.00
500 ₹ 51.80000 ₹ 25,900.00
250 ₹ 52.78000 ₹ 13,195.00
150 ₹ 53.28000 ₹ 7,992.00

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
100 ₹ 53.28000 ₹ 5,328.00

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
2500 ₹ 67.72000 ₹ 1,69,300.00
1000 ₹ 72.24000 ₹ 72,240.00
500 ₹ 75.87000 ₹ 37,935.00
250 ₹ 79.67000 ₹ 19,917.50
100 ₹ 85.00000 ₹ 8,500.00
50 ₹ 89.27000 ₹ 4,463.50
25 ₹ 93.75000 ₹ 2,343.75
10 ₹ 100.06000 ₹ 1,000.60
1 ₹ 117.72000 ₹ 117.72

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 115.70000 ₹ 115.70
10 ₹ 99.68000 ₹ 996.80
25 ₹ 93.45000 ₹ 2,336.25
50 ₹ 88.47000 ₹ 4,423.50
100 ₹ 84.82000 ₹ 8,482.00
250 ₹ 79.48000 ₹ 19,870.00
500 ₹ 75.65000 ₹ 37,825.00
1000 ₹ 72.00000 ₹ 72,000.00
2500 ₹ 67.46000 ₹ 1,68,650.00

Stock:

Distributor: 157


Quantity Unit Price Ext. Price
2400 ₹ 125.49000 ₹ 3,01,176.00
150 ₹ 136.17000 ₹ 20,425.50

Stock:

Distributor: 118


Quantity Unit Price Ext. Price
35 ₹ 174.26000 ₹ 6,099.10
10 ₹ 198.03000 ₹ 1,980.30
1 ₹ 316.84000 ₹ 316.84

Stock:

Distributor: 123


Quantity Unit Price Ext. Price
1 ₹ 647.92000 ₹ 647.92
10 ₹ 567.82000 ₹ 5,678.20
25 ₹ 534.00000 ₹ 13,350.00
50 ₹ 511.75000 ₹ 25,587.50
100 ₹ 489.50000 ₹ 48,950.00
250 ₹ 445.00000 ₹ 1,11,250.00
500 ₹ 400.50000 ₹ 2,00,250.00
1000 ₹ 356.00000 ₹ 3,56,000.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 110
IC Encapsulation Type Tube
Availability Status Active
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 8 (2 x 4)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Gold
Engagement Layer Thickness 30.0µin (0.76µm)
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Open Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Tin
Post Layer Depth 200.0µin (5.08µm)
Solder Tail Material Brass Alloy
Casing Build Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Ambient Temp Range -55°C ~ 125°C

Description

Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Tin. Emphasizes the thickness of the mating finish denoted as 30.0µin (0.76µm). Constructed with the thickness of the post finish evaluated at 200.0µin (5.08µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Brass Alloy. Equipped with features categorized as Open Frame. Constructed from Polycyclohexylenedimethylene Terephthalate (PCT), Polyester material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 8 (2 x 4) for connector layout. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Classification series for the product or component 110. Termination method Solder for electrical or mechanical connections. Type classification DIP, 0.3" (7.62mm) Row Spacing for specifications.