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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Transistor, TO-3 | |
| Grid Pin Array Count | 3 (Rectangular) | |
| Mating Connector Pitch | - | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Brass | |
| Attachment Mounting Style | Chassis Mount | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | - | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | - | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polyester, Glass Filled | |
| Ambient Temp Range | - |
Description
Offers mating contact finish rated at Tin. Provides a post-contact finish defined by Tin. Utilizes the mating contact material designated as Brass. Features the post contact material recognized as Brass. Equipped with features categorized as Closed Frame. Constructed from Polyester, Glass Filled material to guarantee strength and reliability. Mounting configuration Chassis Mount for structural stability. Pins or positions on grid 3 (Rectangular) for connector layout. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections. Type classification Transistor, TO-3 for specifications.
