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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Obsolete | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 16 (2 x 8) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | 60.0µin (1.52µm) | |
| Connecting Pin Material | Phosphor Bronze | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 60.0µin (1.52µm) | |
| Solder Tail Material | Phosphor Bronze | |
| Casing Build Material | Polybutylene Terephthalate (PBT), Glass Filled | |
| Ambient Temp Range | -40°C ~ 105°C |
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