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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Obsolete | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 14 (2 x 7) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Wire Wrap | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 200.0µin (5.08µm) | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polybutylene Terephthalate (PBT) | |
| Ambient Temp Range | -55°C ~ 105°C |
Description
Specifies connector spacing defined as 0.100" (2.54mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Tin. Constructed with the thickness of the post finish evaluated at 200.0µin (5.08µm). Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Brass. Equipped with features categorized as Open Frame. Constructed from Polybutylene Terephthalate (PBT) material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 14 (2 x 7) for connector layout. Temperature range -55°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. The distance 0.100" (2.54mm) to achieve correct alignment with the corresponding connector. The space between posts 0.100" (2.54mm) to ensure compatibility with installation or PCB. Product status Obsolete concerning availability and lifecycle. Termination method Wire Wrap for electrical or mechanical connections. Type classification DIP, 0.3" (7.62mm) Row Spacing for specifications.