Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 368.82000 | ₹ 3,68,820.00 |
| 500 | ₹ 383.85000 | ₹ 1,91,925.00 |
| 250 | ₹ 400.61000 | ₹ 1,00,152.50 |
| 100 | ₹ 425.78000 | ₹ 42,578.00 |
| 50 | ₹ 447.40000 | ₹ 22,370.00 |
| 25 | ₹ 471.59000 | ₹ 11,789.75 |
| 10 | ₹ 507.98000 | ₹ 5,079.80 |
| 5 | ₹ 539.37000 | ₹ 2,696.85 |
| 1 | ₹ 627.84000 | ₹ 627.84 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 445.00000 | ₹ 445.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | SOIC | |
| Grid Pin Array Count | 80 (2 x 40) | |
| Mating Connector Pitch | 0.050" (1.27mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 39.4µin (1.00µm) | |
| Connecting Pin Material | - | |
| Attachment Mounting Style | Surface Mount | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.050" (1.27mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 39.4µin (1.00µm) | |
| Solder Tail Material | - | |
| Casing Build Material | Polyamide (PA6T), Nylon 6T, Glass Filled | |
| Ambient Temp Range | -40°C ~ 130°C |
Description
Specifies connector spacing defined as 0.050" (1.27mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Emphasizes the thickness of the mating finish denoted as 39.4µin (1.00µm). Constructed with the thickness of the post finish evaluated at 39.4µin (1.00µm). Equipped with features categorized as Closed Frame. Constructed from Polyamide (PA6T), Nylon 6T, Glass Filled material to guarantee strength and reliability. Mounting configuration Surface Mount for structural stability. Pins or positions on grid 80 (2 x 40) for connector layout. Temperature range -40°C ~ 130°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The distance 0.050" (1.27mm) to achieve correct alignment with the corresponding connector. The space between posts 0.050" (1.27mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections. Type classification SOIC for specifications.