Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 618.55000 | ₹ 618.55 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 619.81000 | ₹ 619.81 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | SOIC | |
| Grid Pin Array Count | 16 (2 x 8) | |
| Mating Connector Pitch | 0.050" (1.27mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | 100.0µin (2.54µm) | |
| Connecting Pin Material | Copper Alloy | |
| Attachment Mounting Style | Surface Mount | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.050" (1.27mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | 100.0µin (2.54µm) | |
| Solder Tail Material | Copper Alloy | |
| Casing Build Material | Thermoplastic | |
| Ambient Temp Range | - |
Description
Specifies connector spacing defined as 0.050" (1.27mm) for suitable PCB layout. Offers mating contact finish rated at Tin. Provides a post-contact finish defined by Tin. Emphasizes the thickness of the mating finish denoted as 100.0µin (2.54µm). Constructed with the thickness of the post finish evaluated at 100.0µin (2.54µm). Utilizes the mating contact material designated as Copper Alloy. Features the post contact material recognized as Copper Alloy. Equipped with features categorized as Closed Frame. Constructed from Thermoplastic material to guarantee strength and reliability. Mounting configuration Surface Mount for structural stability. Pins or positions on grid 16 (2 x 8) for connector layout. Type of housing Bulk for safeguarding or transporting components. The distance 0.050" (1.27mm) to achieve correct alignment with the corresponding connector. The space between posts 0.050" (1.27mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections. Type classification SOIC for specifications.