Attribute
Description
Manufacturer Part Number
4726
Description
SMT SOCKET - WIDE SOIC-8 (200MIL
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification SOIC
Grid Pin Array Count 8 (2 x 4)
Mating Connector Pitch 0.050" (1.27mm)
Engaging Pin Coating -
Engagement Layer Thickness -
Connecting Pin Material -
Attachment Mounting Style Surface Mount
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval 0.050" (1.27mm)
Post-Contact Pin Layer -
Post Layer Depth -
Solder Tail Material -
Casing Build Material -
Ambient Temp Range -

Description

Specifies connector spacing defined as 0.050" (1.27mm) for suitable PCB layout. Equipped with features categorized as Closed Frame. Mounting configuration Surface Mount for structural stability. Pins or positions on grid 8 (2 x 4) for connector layout. Type of housing Bulk for safeguarding or transporting components. The distance 0.050" (1.27mm) to achieve correct alignment with the corresponding connector. The space between posts 0.050" (1.27mm) to ensure compatibility with installation or PCB. Product status Active concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections. Type classification SOIC for specifications.