Attribute
Description
Manufacturer Part Number
383
Description
40-PIN ZIF SOCKET
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, ZIF (ZIP)
Grid Pin Array Count 40 (2 x 20)
Mating Connector Pitch -
Engaging Pin Coating Gold
Engagement Layer Thickness -
Connecting Pin Material -
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval -
Post-Contact Pin Layer Gold
Post Layer Depth -
Solder Tail Material -
Casing Build Material -
Ambient Temp Range -

Description

Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Equipped with features categorized as Closed Frame. Mounting configuration Through Hole for structural stability. Pins or positions on grid 40 (2 x 20) for connector layout. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections. Type classification DIP, ZIF (ZIP) for specifications.