Attribute
Description
Manufacturer Part Number
382
Description
CONN IC DIP SOCKET 28POS
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 28 (2 x 14)
Mating Connector Pitch -
Engaging Pin Coating -
Engagement Layer Thickness -
Connecting Pin Material -
Attachment Mounting Style -
Key Product Highlights -
Circuit End Method -
Post Pin Interval -
Post-Contact Pin Layer -
Post Layer Depth -
Solder Tail Material -
Casing Build Material -
Ambient Temp Range -

Description

Pins or positions on grid 28 (2 x 14) for connector layout. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Type classification DIP, 0.3" (7.62mm) Row Spacing for specifications.