Attribute
Description
Manufacturer Part Number
248-5205-00
Manufacturer
Description
CONN SOCKET QFN 48POS GOLD
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 110

Quantity Unit Price Ext. Price
20 ₹ 6,876.14000 ₹ 1,37,522.80
15 ₹ 7,016.76000 ₹ 1,05,251.40
10 ₹ 8,863.51000 ₹ 88,635.10
5 ₹ 14,402.87000 ₹ 72,014.35

Stock:

Distributor: 115


Quantity Unit Price Ext. Price
20 ₹ 6,876.14000 ₹ 1,37,522.80
15 ₹ 7,016.76000 ₹ 1,05,251.40
10 ₹ 8,863.51000 ₹ 88,635.10
5 ₹ 14,402.87000 ₹ 72,014.35

Stock:

Distributor: 116


Quantity Unit Price Ext. Price
200 ₹ 6,924.56000 ₹ 13,84,912.00
100 ₹ 7,091.20000 ₹ 7,09,120.00
50 ₹ 7,201.83000 ₹ 3,60,091.50
30 ₹ 7,312.10000 ₹ 2,19,363.00
20 ₹ 7,486.00000 ₹ 1,49,720.00

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
100 ₹ 6,938.64000 ₹ 6,93,864.00
50 ₹ 7,192.20000 ₹ 3,59,610.00
25 ₹ 7,552.25000 ₹ 1,88,806.25
10 ₹ 8,056.17000 ₹ 80,561.70
1 ₹ 9,477.27000 ₹ 9,477.27

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 9,455.36000 ₹ 9,455.36
10 ₹ 6,876.14000 ₹ 68,761.40

Stock:

Distributor: 121


Quantity Unit Price Ext. Price
1 ₹ 9,782.82000 ₹ 9,782.82
10 ₹ 8,434.56000 ₹ 84,345.60

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Textool™
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification QFN
Grid Pin Array Count 48 (4 x 12)
Mating Connector Pitch 0.020" (0.50mm)
Engaging Pin Coating Gold
Engagement Layer Thickness -
Connecting Pin Material Beryllium Copper
Attachment Mounting Style Through Hole
Key Product Highlights Closed Frame
Circuit End Method Solder
Post Pin Interval -
Post-Contact Pin Layer Gold
Post Layer Depth -
Solder Tail Material Beryllium Copper
Casing Build Material Polyethersulfone (PES)
Ambient Temp Range -

Description

Specifies connector spacing defined as 0.020" (0.50mm) for suitable PCB layout. Offers mating contact finish rated at Gold. Provides a post-contact finish defined by Gold. Utilizes the mating contact material designated as Beryllium Copper. Features the post contact material recognized as Beryllium Copper. Equipped with features categorized as Closed Frame. Constructed from Polyethersulfone (PES) material to guarantee strength and reliability. Mounting configuration Through Hole for structural stability. Pins or positions on grid 48 (4 x 12) for connector layout. Type of housing Bulk for safeguarding or transporting components. The distance 0.020" (0.50mm) to achieve correct alignment with the corresponding connector. Product status Active concerning availability and lifecycle. Classification series for the product or component Textool™. Termination method Solder for electrical or mechanical connections. Type classification QFN for specifications.