Description

Runs at a frequency of 13.56MHz. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Die that offers mechanical and thermal protection. Type of package Wafer that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component ST25T. Regulatory compliance criteria ISO 15693, NFC for industry norms. Supplier package type Wafer for component selection. Type classification RFID Transponder for specifications.