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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | my-d™ | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | EEPROM | |
| Oscillation Rate Hz | 13.56MHz | |
| Industry Standards Met | ISO 15693, ISO 18000-3 | |
| User Interface Type | USB | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -25°C ~ 70°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | Die | |
| Vendor Package Type | Wafer |
Description
Runs at a frequency of 13.56MHz. Designed for USB ease of use and user interaction. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Die that offers mechanical and thermal protection. Type of package Wafer that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component my-d™. Regulatory compliance criteria ISO 15693, ISO 18000-3 for industry norms. Supplier package type Wafer for component selection. Type classification EEPROM for specifications.
