Description

Runs at a frequency of 13.56MHz. Designed for USB ease of use and user interaction. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Die that offers mechanical and thermal protection. Type of package Wafer that preserves the integrity of the device. Classification series for the product or component my-d™. Regulatory compliance criteria ISO 15693, ISO 18000-3 for industry norms. Supplier package type Wafer for component selection. Type classification EEPROM for specifications.