Description

Operates with the receiving current set to 4.47mA ~ 10.22mA. Features transmitting current rated at 21mA ~ 120mA. Provides a maximum data rate potential of 300kbps. Runs at a frequency of 150MHz ~ 960MHz. Provides 43 GPIO pins for flexible input/output interfacing. Evaluated as Automotive grade for quality control. Total memory size 128kB Flash for device storage capability. Communication modulation technique BPSK, FSK, GFSK, GMSK, MSK for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 43 for digital links. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 73-UFBGA that offers mechanical and thermal protection. Type of package 73-UFBGA (5x5) that preserves the integrity of the device. The necessary output power 22dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication LoRaWAN 1.0, Sigfox, Wireless M-Bus for control or interaction. Certification AEC-Q100 for compliance with testing or regulatory standards. Type or family of RF protocol General ISM < 1GHz for communication standards. Rating for the sensitivity of sensor or input response -148dBm. Ports designated for serial communication interfaces ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART. Supplier package type 73-UFBGA (5x5) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 1.8V ~ 3.6V for device operation.