Description

Operates with the receiving current set to 4.5mA ~ 7.9mA. Features transmitting current rated at 5.2mA ~ 12.7mA. Provides a maximum data rate potential of 2Mbps. Runs at a frequency of 2.405GHz ~ 2.48GHz. Provides 72 GPIO pins for flexible input/output interfacing. Total memory size 512kB Flash, 256kB SRAM for device storage capability. Communication modulation technique GFSK for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 72 for digital links. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 100-UFBGA, WLCSP that offers mechanical and thermal protection. Type of package 100-WLCSP (4.4x4.38) that preserves the integrity of the device. The necessary output power 6dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication Bluetooth v5.3, Thread, Zigbee® for control or interaction. Type or family of RF protocol 802.15.4, Bluetooth for communication standards. Rating for the sensitivity of sensor or input response -100dBm. Ports designated for serial communication interfaces ADC, I2C, SPI, UART, USART, USB. Classification series for the product or component STM32WB55xx. Supplier package type 100-WLCSP (4.4x4.38) for component selection. Voltage requirement 1.71V ~ 3.6V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 1.71V ~ 3.6V for device operation.